The continuous increase in the variety of sophisticated electronic components, as well as the growing demand for their reliability and durability gives birth to a need in effective and reliable removal method of impurities in the form of particles, films and other contaminants. Even microscopic contamination can cause significant financial losses due to malfunctions and damage electronic systems. Regardless of the type of items to be cleaned, whether it is silicon wafer, printed circuit boards, electronic contact or light alloy board, there are different solutions, for example, wet chemical cleaning, or carbon dioxide plasma, which can achieve the desired degree of purity in an economically efficient manner.
The universal power of ultrasound
Wet chemical ultrasonic cleaning with solvents, alcohols or modified aqueous solutions is widely used in manufacturing industries. Such companies, like Hilsonic, producing a wide array of ultrasonic cleaner equipment, confirmed the impressive potential of the approach (the line-up of cleaners remove particles, flux residue contamination, oil films and etc.). Apart from the type of detergent another decisive factor is the frequency of the cleaning efficiency of electrical pulses generated and transmitted by the ultrasonic generator in the form of sound waves in the oscillatory system with a liquid container. For this method, the following is true: the lower the frequency of the electrical pulses, the higher the energy of the sound waves is.
A good example of this method is quality cleaning after soldering printed circuit boards for good adhesion of the protective varnish that is applied subsequently. The most important thing is to remove flux residues and fingerprints that may remain on the surface. The standard process consists of two stages: the first one is ultrasonic cleaning of products stored in a container, during which the holder parts also makes additional oscillatory motion. After these steps the products must be washed with double deionised water and dried.Continue Reading...